Diffusion plate support frames, direct-type backlight modules and display apparatuses

ABSTRACT

The present disclosure relates to a diffusion plate support frame, a direct-type backlight module and a display apparatus. The diffusion plate support frame includes: a bottom plate; and one or more support portions, each of the one or more support portions is located on the bottom plate and comprises: a first buffer structure, and a support pin. The first buffer structure is located between the bottom plate and the support pin, and the first buffer structure is used for buffering pressure when subjected to a pressure applied by the support pin towards the bottom plate

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to Chinese Patent Application No.202022600722.4 entitled “DIFFUSION PLATE SUPPORT FRAMES, DIRECT-TYPEBACKLIGHT MODULES AND DISPLAY APPARATUSES” filed on Nov. 11, 2020, theentire content of which is incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technology, andin particular to, diffusion plate support frames, direct-type backlightmodules and display apparatuses.

BACKGROUND

A liquid crystal display apparatus generally needs to use a backlightmodule to provide a light source. According to different distributionpositions of the backlight module in the liquid crystal displayapparatus, the backlight module can be divided into two types: side-typebacklight module and direct-type backlight module. The side-typebacklight module is placed on a side of the liquid crystal display, andthe direct-type backlight module is placed below the liquid crystaldisplay. In general, the direct-type backlight module includescomponents such as light source, plastic frame, optical film anddiffusion plate. The diffusion plate is arranged above the light source,but the diffusion plate may bend and deform under the action of gravity,so a diffusion plate support frame is needed to support the diffusionplate.

SUMMARY

According to a first aspect of embodiments of the present disclosure,there is provided a diffusion plate support frame, including: a bottomplate; and one or more support portions, each of the one or more supportportions is located on the bottom plate and includes: a first bufferstructure, and a support pin; wherein the first buffer structure islocated between the bottom plate and the support pin, and the firstbuffer structure is used for buffering pressure when subjected to apressure applied by the support pin towards the bottom plate.

In an embodiment, the first buffer structure and the bottom plateenclose a buffer space.

In an embodiment, the first buffer structure includes a first supportplate, a second support plate and a third support plate, the firstsupport plate, the second support plate and the third support plate aresequentially connected, and the first support plate and the thirdsupport plate are located between the second support plate and thebottom plate; the first support plate, the second support plate, thethird support plate and the bottom plate enclose the buffer space; andthe support pin is located on the second support plate.

In an embodiment, the support pin includes a second buffer structure,and the second buffer structure is located at an end of the support pinaway from the bottom plate, and the second buffer structure is used forbuffering pressure when subjected to a pressure towards the bottomplate.

In an embodiment, the second buffer structure is arc-shaped.

In an embodiment, a radian of the second buffer structure is greaterthan or equal to 135°.

In an embodiment, the support pin further includes a pillar and one ormore auxiliary support plates, the pillar is fixedly connected with eachof the one or more auxiliary support plates, a height of the pillar isgreater than a height of each of the auxiliary support plates, and awidth of each of the auxiliary support plates gradually decreases fromthe bottom plate to a direction away from the bottom plate, and thesecond buffer structure is located at an end of the pillar away from thebottom plate.

In an embodiment, the support pin is a cone, and a diameter of thesupport pin gradually decreases from the bottom plate to a directionaway from the bottom plate.

In an embodiment, the support pin includes at least two auxiliarysupport plates, and the at least two auxiliary support plates aredistributed radially around the pillar.

In an embodiment, the diffusion plate support frame further includes aboss, a clamping portion and a positioning column, the boss is locatedat a side of the bottom plate away from the support pin, and theclamping portion and the positioning column are located at a side of theboss away from the bottom plate; the clamping portion includes a slot,and a height of the positioning column is greater than or equal to adepth of the slot; and the positioning column is a cylinder, and adiameter of the positioning column is 2 mm to 3 mm.

In an embodiment, a number of the support portions on the bottom plateis N, and N is a positive integer greater than or equal to 2.

In an embodiment, a thickness of the bottom plate is 1 mm to 2 mm; ashape of the bottom plate is circular or rectangular; a height of thefirst buffer structure is 2 mm to 4 mm; a size of the first bufferstructure is smaller than a size of the bottom plate; if the shape ofthe bottom plate is rectangular and a projection of the first bufferstructure on the bottom plate is rectangular, a length of the firstbuffer structure is less than a length of the bottom plate, and a widthof the first buffer structure is less than a width of the bottom plate;a material of the bottom plate and a material of the first bufferstructure are same as a material of the support pin; the material of thebottom plate, the material of the first buffer structure and thematerial of the support pin are colorless transparent materials or milkywhite plastics; the bottom plate, the first buffer structure and thesupport pin are integrally injection molded by a mold.

According to a second aspect of embodiments of the present disclosure,there is provided a direct-type backlight module, including: a backplate, a backlight source, a diffusion plate, and a diffusion platesupport frame, including: a bottom plate; and one or more supportportions, each of the one or more support portions is located on thebottom plate and includes: a first buffer structure, and a support pin;wherein the first buffer structure is located between the bottom plateand the support pin, and the first buffer structure is used forbuffering pressure when subjected to a pressure applied by the supportpin towards the bottom plate; and the backlight source and the diffusionplate support frame are located on the back plate, the diffusion plateis located above the diffusion plate support frame, and there is a gapbetween the diffusion plate and the diffusion plate support frame.

In an embodiment, when the diffusion plate support frame includes aboss, a clamping portion, and a positioning column, the direct-typebacklight module further includes a reflector plate, the back plateincludes a first opening and a second opening, and the reflector plateincludes a third opening; projections of the first opening and thesecond opening on the bottom plate are located in a projection of thethird opening on the bottom plate; the reflector plate is locatedbetween the bottom plate and the back plate, the clamping portionsequentially passes through the third opening and the first opening, andthe clamping portion and the boss clamp the back plate in cooperation, asize of the first opening matches a size of the clamping portion, thepositioning column sequentially passes through the third opening and thesecond opening, and a size of the second opening matches a size of thepositioning column; the reflector plate is adjacent to the boss, and athickness of the reflector plate is same as a thickness of the boss.

In an embodiment, a shape of the first opening is rectangular, a lengthof the first opening is 5 mm to 10 mm, and a width of the first openingis 3 mm to 5 mm; a shape of the second opening is circular; a diameterof the second opening is 2.1 mm to 3.2 mm; a shape of the third openingis rectangular, a length of the third opening is 22.2 mm to 24.2 mm, anda width of the third opening is 2.1 mm to 3.2 mm.

In an embodiment, when the clamping portion includes a slot, a depth ofthe slot is equal to a thickness of the back plate.

In an embodiment, the direct-type backlight module includes a pluralityof diffusion plate support frames and a plurality of backlight sourcesarranged in an array; each of the plurality of diffusion plate supportframes is located between two adjacent rows of backlight sourcesarranged along a first direction; the plurality of diffusion platesupport frames are uniformly distributed in the first direction, twoadjacent diffusion plate support frames in a second direction arearranged in a staggered arrangement, and the first direction intersectsthe second direction; or, the plurality of diffusion plate supportframes are uniformly distributed in the first direction and the seconddirection, respectively, and the first direction intersects the seconddirection.

In an embodiment, the first direction is perpendicular to the seconddirection; a distance between two adjacent backlight sources is 40 mm to60 mm; a distance between two adjacent diffusion plate support frames inthe first direction is 150 mm to 200 mm; a distance between two adjacentdiffusion plate support frames in the second direction is 100 mm to 150mm; when a number of the support portions on a same bottom plate is N, adistance between two adjacent support portions is equal to the distancebetween two adjacent backlight sources.

In an embodiment, a distance between the diffusion plate and the supportportion is greater than or equal to 1 mm and less than or equal to 2 mm.

According to a third aspect of embodiments of the present disclosure,there is provided a display apparatus including the above-mentioneddirect-type backlight modules.

It should be understood that the above general description and thefollowing detailed description are only exemplary and explanatory, anddo not limit the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

The drawings herein are incorporated in and constitute a part of thespecification, illustrate embodiments consistent with the presentdisclosure, and together with the description serve to explain theprinciples of the disclosure.

FIG. 1 is a schematic structural diagram of a diffusion plate supportframe according to an embodiment of the present disclosure.

FIG. 2 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 3 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 4 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 5 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 6 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 7 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 8 is a schematic structural diagram of another diffusion platesupport frame according to an embodiment of the present disclosure.

FIG. 9 is a schematic structural diagram of a direct-type backlightmodule according to an embodiment of the present disclosure.

FIG. 10 is a schematic structural diagram of another direct-typebacklight module according to an embodiment of the present disclosure.

FIG. 11 is a schematic structural diagram of another direct-typebacklight module according to an embodiment of the present disclosure.

FIG. 12 is a schematic structural diagram of another direct-typebacklight module according to an embodiment of the present disclosure.

FIG. 13 is a schematic structural diagram of another direct-typebacklight module according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Examples will be described in detail herein, with the illustrationsthereof represented in the drawings. When the following descriptionsinvolve the drawings, same numbers in different drawings refer to sameor similar elements unless otherwise indicated. The embodimentsdescribed in the following examples do not represent all embodimentsconsistent with the present disclosure. Rather, they are merely examplesof apparatuses and methods consistent with some aspects of the presentdisclosure as detailed in the appended claims.

An embodiment of the present disclosure provides a diffusion platesupport frame/diffusion plate support structure. A diffusion platesupport frame 1 shown in FIG. 1 includes a bottom plate 11 and a supportportion 12, and the support portion 12 is located on the bottom plate11. The support portion 12 includes a first buffer structure 121 and asupport pin 122. The first buffer structure 121 is located between thebottom plate 11 and the support pin 122, and the first buffer structure121 is used for buffering pressure when subjected to a pressure appliedby the support pin 122 towards the bottom plate 11.

In this embodiment, since there is a first buffer structure between thebottom plate and the support portion, the first buffer structure plays abuffer role when subjected to a pressure applied by the support pintowards the bottom plate. Therefore, when the support portion iscompressed by the diffusion plate, the first buffer structure can play abuffer role, which can prevent the diffusion plate support frame fromscratching the diffusion plate when the diffusion plate collapsesdownward.

The diffusion plate support frame 1 provided by the embodiment of thepresent disclosure is briefly introduced above, and the diffusion platesupport frame 1 provided by the embodiment of the present disclosurewill be described in detail below.

An embodiment of the present disclosure further provides a diffusionplate support frame/diffusion plate support structure 1. The diffusionplate support frame 1, as shown in FIG. 1, includes the bottom plate 11,the support portion 12, a boss 13, a clamping portion 14 and apositioning column 15.

As shown in FIG. 1, the support portion 12 is located on the bottomplate 11. The support portion 12 includes the first buffer structure 121and the support pin 122. The first buffer structure 121 is locatedbetween the bottom plate 11 and the support pin 122, and the firstbuffer structure 121 is used for buffering pressure when subjected to apressure applied by the support pin 122 towards the bottom plate 11.

As shown in FIG. 1, the first buffer structure 121 and the bottom plate11 enclose a buffer space 16. When the support portion 12 is compressedby the diffusion plate, the first buffer structure 121 can deform to thebuffer space 16 to play a buffer role, which can prevent the diffusionplate support frame from scratching the diffusion plate when thediffusion plate collapses downward.

In this embodiment, the first buffer structure 121 may include a firstsupport plate 1211, a second support plate 1212, and a third supportplate 1213. The first support plate 1211, the second support plate 1212,and the third support plate 1213 are sequentially connected. The firstsupport plate 1211 and the third support plate 1213 are located betweenthe second support plate 1212 and the bottom plate 11. The first supportplate 1211, the second support plate 1212, the third support plate 1213and the bottom plate 11 enclose the buffer space 16, and the support pin122 is located on the second support plate 1212.

As shown in FIG. 1, in this embodiment, a shape of the bottom plate 11may be rectangular. In another embodiment, the shape of the bottom plate11 may be circular. In other embodiments, the bottom plate 11 may beother shapes. A thickness of the bottom plate 11 may be 1 mm to 2 mm. Inanother embodiment, the thickness of the bottom plate 11 is 1.5 mm to 2mm. For example, the thickness of the bottom plate 11 may be 1 mm, 1.5mm, 1.7 mm, or 2 mm.

In this embodiment, a height H112 of the first buffer structure 121 maybe 2 mm to 4 mm. For example, the height H112 of the first bufferstructure 121 may be 2 mm, 2.8 mm, or 4 mm.

In this embodiment, a size of the first buffer structure 121 is smallerthan a size of the bottom plate 11. When the shape of the bottom plate11 is rectangular and a projection of the first buffer structure 121 onthe bottom plate 11 is rectangular, a length of the first bufferstructure 121 is smaller than a length of the bottom plate 11, and awidth of the first buffer structure 121 is smaller than a width of thebottom plate 11.

As shown in FIGS. 1 and 2, in this embodiment, the support pin 122 mayinclude a pillar 1221, an auxiliary support plate 1222, and a secondbuffer structure 1223.

As shown in FIG. 1, in this embodiment, the pillar 1221 is fixedlyconnected with the auxiliary support plate 1222, a height H11 of thepillar 1221 is greater than a height H111 of the auxiliary support plate1222, and a width W of the auxiliary support plate 1222 graduallydecreases from the bottom plate 11 to a direction away from the bottomplate 11. For example, a shape of the auxiliary support plate 1222 maybe triangular or trapezoidal.

In this embodiment, the support pin 122 may include at least twoauxiliary support plates 1222, and the at least two auxiliary supportplates 1222 are distributed radially around the pillar 1221. Forexample, the support pin 122 may include four auxiliary support plates1222, and the four auxiliary support plates 1222 are distributed in across shape. Of course, the number of auxiliary support plates 1222 mayalternatively be one, two, three, or other numbers.

In this embodiment, when the number of auxiliary support plates 1222 isgreater than two, the heights of all auxiliary support plates 1222 maybe same or different.

As shown in FIG. 1, in this embodiment, the second buffer structure 1223is located at an end of the pillar 1221 away from the bottom plate 11.The second buffer structure 1223 is used for buffering pressure whensubjected to a pressure towards the bottom plate 11.

As shown in FIGS. 1-2, in this embodiment, the second buffer structure1223 may be arc-shaped. A radian a of the second buffer structure 1223may be greater than or equal to 135°. For example, the radian a of thesecond buffer structure 1223 may be 135°, 140°, 150° or other degrees.

As shown in FIG. 1, in this embodiment, the support pin 122 includes thesecond buffer structure 1223, and the second buffer structure 1223 islocated at an end of the support pin 122 away from the bottom plate 11.When the support portion 12 is compressed by the diffusion plate, thesecond buffer structure 1223 can deform towards the bottom plate 11 toplay a buffer role, which can prevent the diffusion plate support framefrom scratching the diffusion plate when the diffusion plate collapsesdownward.

As shown in FIG. 1, in this embodiment, the boss 13 is located at a sideof the bottom plate 11 away from the support pin 122, and the clampingportion 14 and the positioning column 15 are located at a side of theboss 13 away from the bottom plate 11.

As shown in FIG. 1, in this embodiment, the clamping portion 14 mayinclude a slot 141. A height H101 of the positioning column 15 may begreater than a depth H100 of the slot 141. In another embodiment, theheight H101 of the positioning column 15 may be equal to the depth H100of the slot 141. The height H101 of the positioning column 15 is equalto a distance between a surface of the boss 13 away from the bottomplate 11 and an end of the positioning column 15 away from the bottomplate 11. In an embodiment, the positioning column 15 is a cylinder, anda diameter of the positioning column 15 is 2 mm to 3 mm.

In this embodiment, a material of the bottom plate 11, a material of thefirst buffer structure 121, and a material of the support pin 122 may besame, for example, they may all be colorless transparent materials, orthey may all be milky white plastics. In another embodiment, thematerial of the bottom plate 11, the material of the first bufferstructure 121, and the material of the support pin 122 may be different.

In this embodiment, the bottom plate 11, the first buffer structure 121and the support pin 122 may be integrally injection molded by a mold.

An embodiment of the present disclosure further provides a diffusionplate support frame 1. The difference from the above-mentionedembodiments is that in this embodiment, as shown in FIG. 3, the supportpin 122 is a cone, and a diameter of the support pin 122 graduallydecreases from the bottom plate 11 to a direction away from the bottomplate 11. The structures of other parts can be referred to theabove-mentioned embodiments in case of no conflict, and thus will not berepeated here.

Optionally, a second buffer structure 1223 is disposed on the top of thecone support pin 122, the second buffer structure 1223 may bearc-shaped, and a radian a of the second buffer structure 1223 may begreater than or equal to 135°.

An embodiment of the present disclosure further provides a diffusionplate support frame/diffusion plate support structure 1. The differencefrom the above-mentioned embodiments is that, in this embodiment, thenumber of support portions 12 on a same bottom plate 11 is N, and N is apositive integer greater than or equal to 2.

For example, as shown in FIGS. 4 and 5, the number of support portions12 on a same bottom plate 11 may be two, and the two support portions 12include a first support portion 123 and a second support portion 124. Inan embodiment, the bottom plate 11 includes a first bottom plate portion111, a second bottom plate portion 112, and a connecting portion 113.The connecting portion 113 is located between the first bottom plateportion 111 and the second bottom plate portion 112 for connecting thefirst bottom plate portion 111 and the second bottom plate portion 112.The first bottom plate portion 111 is circular, the second bottom plateportion 112 is circular, and the connecting portion 113 is rectangular.In other embodiments, the first bottom plate portion 111, the secondbottom plate portion 112, and the connecting portion 113 may be othershapes. The first support portion 123 is located on the first bottomplate portion 111, and the second support portion 124 is located on thesecond bottom plate portion 112.

For example, as shown in FIGS. 6 and 7, the number of support portions12 on a same bottom plate 11 can be three, and the three supportportions 12 include a first support portion 123, a second supportportion 124, and a third support portion 125. In an embodiment, thebottom plate 11 includes a first bottom plate portion 111, a secondbottom plate portion 112, a third bottom plate portion 114, and twoconnecting portions 113. One of the two connecting portions 113 islocated between the first bottom plate portion 111 and the third bottomplate portion 114, and the other connecting portion 113 is locatedbetween the second bottom plate portion 112 and the third bottom plateportion 114. The first bottom plate portion 111 is circular, the secondbottom plate portion 112 is circular, and the third bottom plate portion114 is rectangular. In other embodiments, the first bottom plate portion111, the second bottom plate portion 112, and the third bottom plateportion 114 may be other shapes. The first support portion 123 islocated on the first bottom plate portion 111, the second supportportion 124 is located on the second bottom plate portion 112, and thethird support portion 125 is located on the third bottom plate portion114.

For example, when the number of support portions 12 on a same bottomplate 11 is three, a length L1 of the bottom plate 11 is 96 mm. As shownin FIG. 8, for example, a distance D11 between two adjacent supportportions 12 is 45 mm. As shown in FIG. 1, for example, the height H112of the first buffer structure 121 is 2.8 mm, the depth H100 of the slot141 is 1.0 mm, the height H101 of the positioning column 15 is 2.4 mm, alength L101 of the boss 13 is 26 mm, and a thickness H03 of the boss 13is 1.0 mm. A distance H10 between a surface of the bottom plate 11 closeto the support portion 12 and an end of the clamping portion 14 awayfrom the bottom plate 11 is 4.4 mm, and a distance H11 (the height ofthe pillar 1221) between a surface of the bottom plate 11 close to thesupport portion 12 and an end of the support portion 12 away from thebottom plate 11. The height H101 of the positioning column 15 is equalto a distance between a surface of the boss 13 away from the bottomplate 11 and an end of the positioning column 15 away from the bottomplate 11.

As shown in FIG. 8, when the shape of the bottom plate 11 is rectangularand the projection of the first buffer structure 121 on the bottom plate11 is rectangular, a length L112 of the first buffer structure 121 issmaller than the length of the bottom plate 11, and a width W112 of thefirst buffer structure 121 is smaller than the width of the bottom plate11. When the shape of the bottom plate 11 is circular and the projectionof the first buffer structure 121 on the bottom plate 11 is rectangular,the length L112 of the first buffer structure 121 is smaller than adiameter of the bottom plate 11, and the width W112 of the first bufferstructure 121 is smaller than the diameter of the bottom plate 11.

An embodiment of the present disclosure further provides a direct-typebacklight module. As shown in FIG. 9, the direct-type backlight modulemay include a reflector plate 2, a back plate 3, a plurality ofbacklight sources 5 (see FIGS. 11-13), a diffusion plate 4, and thediffusion plate support structure/frame 1 of any of the aboveembodiments.

In this embodiment, the plurality of backlight sources 5 and thediffusion plate support frame 1 are located on the back plate 3, thediffusion plate 4 is located above the diffusion plate support frame 1,and there is a gap between the diffusion plate 4 and the diffusion platesupport frame 1.

In this embodiment, a distance between the diffusion plate 4 and thesupport portion 12 is greater than or equal to 1 mm and less than orequal to 2 mm.

In this embodiment, a distance between the diffusion plate 4 and thereflector plate 2 is H20, and a distance between an end of the supportportion 12 close to the diffusion plate 4 and the reflector plate 2 isH110, D=H20−H110, 1 mm≤D≤2 mm.

In this embodiment, the plurality of backlight sources 5 may be LED lampbeads.

In this embodiment, as shown in FIG. 10, the back plate 3 may include afirst opening 31 and a second opening 32, and the reflector plate 2 mayinclude a third opening 21. Projections of the first opening 31 and thesecond opening 32 on the bottom plate 11 are located in a projection ofthe third opening 21 on the bottom plate 11.

In this embodiment, as shown in FIG. 9, the reflector plate 2 is locatedbetween the bottom plate 11 and the back plate 3, the clamping portion14 sequentially passes through the third opening 21 and the firstopening 31, and the clamping portion 14 and the boss 13 clamp the backplate 3 in cooperation. A size of the first opening 31 matches a size ofthe clamping portion 14. The positioning column 15 sequentially passesthrough the third opening 21 and the second opening 32, and a size ofthe second opening 32 matches a size of the positioning column 15. Thereflector plate 2 is adjacent to the boss 13 and located on a same layeras the boss 13, and a thickness of the reflector plate 2 is same as thethickness H03 of the boss 13.

In this embodiment, the size of the first opening 31 is 0.1 mm to 0.2 mmlarger than the size of the clamping portion 14, and the size of thesecond opening 32 is 0.1 mm to 0.2 mm larger than the size of thepositioning column 15, such that the clamping portion 14 can passthrough the first opening 31 and the positioning column 15 can passthrough the second opening 32.

In this embodiment, a length of the clamping portion 14 may be 20 mm, awidth of the clamping portion 14 may be 2 mm, and a height of theclamping portion 14 may be 2 mm, but is not limited thereto.

In this embodiment, a shape of the first opening 31 may be rectangular,and a length of the first opening 31 may be 5 mm to 10 mm. For example,the length of the first opening 31 is 5 mm, 7 mm, or 10 mm. A width ofthe first opening 31 is 3 mm to 5 mm. For example, the width of thefirst opening 31 is 3 mm, 4 mm, or 5 mm.

In this embodiment, a shape of the second opening 32 may be circular,and a diameter of the second opening 32 may be 0.1 mm to 0.2 mm largerthan the diameter of the positioning column 15. The diameter of thesecond opening 32 may be 2.1 mm to 3.2 mm. For example, when thediameter of the positioning column 15 is 2 mm, the diameter of thesecond opening 32 is 2.1 mm or 2.2 mm. In other embodiments, the shapeof the second opening 32 may also be rectangular or other shapes.

In this embodiment, a shape of the third opening 21 may be rectangular,and a length of the third opening 21 may be 22.2 mm to 24.2 mm. A widthof the third opening 21 may be 2.1 mm to 3.2 mm. For example, the lengthof the third opening 21 is 24.2 mm, and the width of the third opening21 is 2.2 mm. Of course, the length and width of the third opening 21can also be other values.

In this embodiment, the depth H100 of the slot 141 may be equal to thethickness of the back plate 3. In other embodiments, the clampingportion 14 may be made of an elastic material. In this case, the depthH100 of the slot 141 may be smaller than the thickness of the back plate3, such that the clamping portion 14 can better cooperate with the boss13 to clamp the back plate 3.

In this embodiment, since the diffusion plate support frame 1 can befixed on the back plate 3 through the clamping portion 14 and thepositioning column 15, no locking screws or double-sided tape areneeded, which can reduce the cost. Moreover, no complex hook and clawstructure is used, and the structure is simple, which is beneficial toimprove the yield. Further, by sliding the clamping portion 14 into thefirst opening 31, the diffusion plate support frame 1 can be fixed, andthe diffusion plate support frame 1 can be drawn out by slightly pullingup the positioning column 15, which is convenient for disassembly andassembly, and the diffusion plate support frame 1 can be reused toimprove the utilization rate of the diffusion plate support frame 1.

In this embodiment, as shown in FIG. 11, the direct-type backlightmodule includes a plurality of diffusion plate support frames 1 and aplurality of backlight sources 5 arranged in an array.

In this embodiment, as shown in FIG. 11, each of the plurality ofdiffusion plate support frames 1 is located between two adjacent rows ofbacklight sources 5 arranged along a first direction F1.

In this embodiment, as shown in FIG. 11, the plurality of diffusionplate support frames 1 are uniformly distributed in the first directionF1, and two adjacent diffusion plate support frames 1 in a seconddirection F2 are arranged in a staggered arrangement. The firstdirection F1 intersects the second direction F2. In an embodiment, thefirst direction F1 is perpendicular to the second direction F2.

In this embodiment, a distance D3 between two adjacent backlight sources5 is 40 mm to 60 mm. For example, the distance D3 between two adjacentbacklight sources 5 is 40 mm, 50 mm, or 60 mm.

In this embodiment, as shown in FIG. 11, a distance D1 between twoadjacent diffusion plate support frames 1 in the first direction F1 is150 mm to 200 mm. For example, the distance D1 between two adjacentdiffusion plate support frames 1 in the first direction F1 is 150 mm,180 mm, or 200 mm.

In this embodiment, as shown in FIG. 11, a distance D2 between twoadjacent diffusion plate support frames 1 in the second direction F2 is100 mm to 150 mm. For example, the distance D2 between two adjacentdiffusion plate support frames 1 in the second direction F2 is 100 mm,130 mm, or 150 mm.

In this embodiment, as shown in FIG. 11, the number of support portions12 on a same bottom plate 11 is three, and the distance D11 between twoadjacent support portions 12 is equal to the distance D3 between twoadjacent backlight sources 5. In other embodiments, the distance D11between two adjacent support portions 12 may be larger or smaller thanthe distance D3 between two adjacent backlight sources 5.

In this embodiment, as shown in FIG. 11, in the second direction F2, thefirst row of diffusion plate support frames includes four diffusionplate support frames 1, the second row of diffusion plate support framesincludes three diffusion plate support frames 1, and the third row ofdiffusion plate support frames includes four diffusion plate supportframes 1.

In this embodiment, as shown in FIG. 12, in the second direction F2, thefirst row of diffusion plate support frames includes three diffusionplate support frames 1, the second row of diffusion plate support framesincludes four diffusion plate support frames 1, and the third row ofdiffusion plate support frames includes three diffusion plate supportframes 1.

In this embodiment, as shown in FIG. 13, the plurality of diffusionplate support frames 1 may be uniformly distributed in the firstdirection F1 and the second direction F2, respectively. In the seconddirection F2, the first row of diffusion plate support frames includesfour diffusion plate support frames 1, the second row of diffusion platesupport frames includes four diffusion plate support frames 1, and thethird row of diffusion plate support frames includes four diffusionplate support frame 1.

An embodiment of the present disclosure further provides a displayapparatus, including a display module, and further including thedirect-type backlight module of any of the above-mentioned embodiments.

In this embodiment, since there is a first buffer structure between thebottom plate and the support portion, the first buffer structure plays abuffer role when subjected to a pressure applied by the support pintowards the bottom plate. Therefore, when the support portion iscompressed by the diffusion plate, the first buffer structure can play abuffer role, which can prevent the diffusion plate support frame fromscratching the diffusion plate when the diffusion plate collapsesdownward.

It should be noted that the display apparatus in this embodiment can beany product or component with display function, such as electronicpaper, mobile phone, tablet computer, television, notebook computer,digital photo frame, navigator, etc.

It should be noted that, in the drawings, the sizes of layers andregions may be exaggerated for clarity of illustration. It is understoodthat when an element or layer is referred to as being “on” anotherelement or layer, it may be directly on other elements, or interveninglayers may be present. In addition, it is understood that when anelement or layer is referred to as being “under” another element orlayer, it may be directly under other elements, or there may be morethan one intermediate layer or element. In addition, it is alsounderstood that when a layer or element is referred to as being“between” two layers or two elements, it may be the only layer betweenthe two layers or the two elements, or there may also be more than oneintermediate layer or element. Throughout similar reference numeralsindicate similar elements.

In this disclosure, the terms “first” and “second” are used fordescriptive purposes only, and cannot be understood as indicating orimplying relative importance. The term “plurality” refers to two ormore, unless specifically defined otherwise.

Other implementations of the present disclosure will be apparent tothose skilled in the art from consideration of the specification andpractice of the present disclosure herein. The present disclosure isintended to cover any variations, uses or adaptive modification thatfollow the general principles of the present disclosure and includecommon knowledge or conventional technical means in the related art thatare not disclosed in the present disclosure. The specification andembodiments are considered as exemplary only, with a true scope andspirit of the present disclosure being indicated by the followingclaims.

It is to be understood that the present disclosure is not limited to theprecise structure described above and shown in the accompanyingdrawings, and that various modifications and changes may be made withoutdeparting from the scope thereof. The scope of the present disclosure islimited only by the appended claims.

What is claimed is:
 1. A diffusion plate support frame, comprising: abottom plate; and one or more support portions, each of the one or moresupport portions is located on the bottom plate and comprises: a firstbuffer structure, and a support pin; wherein the first buffer structureis located between the bottom plate and the support pin, and the firstbuffer structure is used for buffering pressure when subjected to apressure applied by the support pin towards the bottom plate.
 2. Thediffusion plate support frame according to claim 1, wherein the firstbuffer structure and the bottom plate enclose a buffer space.
 3. Thediffusion plate support frame according to claim 2, wherein the firstbuffer structure comprises a first support plate, a second support plateand a third support plate, the first support plate, the second supportplate and the third support plate are sequentially connected, and thefirst support plate and the third support plate are located between thesecond support plate and the bottom plate, the first support plate, thesecond support plate, the third support plate and the bottom plateenclose the buffer space; and the support pin is located on the secondsupport plate.
 4. The diffusion plate support frame according to claim1, wherein the support pin comprises a second buffer structure, and thesecond buffer structure is located at an end of the support pin awayfrom the bottom plate, and the second buffer structure is used forbuffering pressure when subjected to a pressure towards the bottomplate.
 5. The diffusion plate support frame according to claim 4,wherein the second buffer structure is arc-shaped.
 6. The diffusionplate support frame according to claim 5, wherein a radian of the secondbuffer structure is greater than or equal to 135°.
 7. The diffusionplate support frame according to claim 4, wherein the support pinfurther comprises a pillar and one or more auxiliary support plates, thepillar is fixedly connected with each of the one or more auxiliarysupport plates, a height of the pillar is greater than a height of eachof the auxiliary support plates, and a width of each of the auxiliarysupport plates gradually decreases from the bottom plate to a directionaway from the bottom plate, and the second buffer structure is locatedat an end of the pillar away from the bottom plate.
 8. The diffusionplate support frame according to claim 1, wherein the support pin is acone, and a diameter of the support pin gradually decreases from thebottom plate to a direction away from the bottom plate.
 9. The diffusionplate support frame according to claim 7, wherein the support pincomprises at least two auxiliary support plates, and the at least twoauxiliary support plates are distributed radially around the pillar. 10.The diffusion plate support frame according to claim 1, furthercomprising a boss, a clamping portion and a positioning column, the bossis located at a side of the bottom plate away from the support pin, andthe clamping portion and the positioning column are located at a side ofthe boss away from the bottom plate; the clamping portion comprises aslot, and a height of the positioning column is greater than or equal toa depth of the slot; and the positioning column is a cylinder, and adiameter of the positioning column is 2 mm to 3 mm.
 11. The diffusionplate support frame according to claim 1, wherein a number of thesupport portions on the bottom plate is N, and N is a positive integergreater than or equal to
 2. 12. The diffusion plate support frameaccording to claim 1, wherein a thickness of the bottom plate is 1 mm to2 mm; a shape of the bottom plate is circular or rectangular; a heightof the first buffer structure is 2 mm to 4 mm; a size of the firstbuffer structure is smaller than a size of the bottom plate; if theshape of the bottom plate is rectangular and a projection of the firstbuffer structure on the bottom plate is rectangular, a length of thefirst buffer structure is less than a length of the bottom plate, and awidth of the first buffer structure is less than a width of the bottomplate; a material of the bottom plate and a material of the first bufferstructure are same as a material of the support pin; the material of thebottom plate, the material of the first buffer structure and thematerial of the support pin are colorless transparent materials or milkywhite plastics; the bottom plate, the first buffer structure and thesupport pin are integrally injection molded by a mold.
 13. A direct-typebacklight module, comprising: a back plate, a backlight source, adiffusion plate, and a diffusion plate support frame, comprising: abottom plate; and one or more support portions, each of the one or moresupport portions is located on the bottom plate and comprises: a firstbuffer structure, and a support pin; wherein the first buffer structureis located between the bottom plate and the support pin, and the firstbuffer structure is used for buffering pressure when subjected to apressure applied by the support pin towards the bottom plate; and thebacklight source and the diffusion plate support frame are located onthe back plate, the diffusion plate is located above the diffusion platesupport frame, and there is a gap between the diffusion plate and thediffusion plate support frame.
 14. The direct-type backlight moduleaccording to claim 13, wherein, when the diffusion plate support framecomprises a boss, a clamping portion, and a positioning column, thedirect-type backlight module further comprises a reflector plate, theback plate comprises a first opening and a second opening, and thereflector plate comprises a third opening; projections of the firstopening and the second opening on the bottom plate are located in aprojection of the third opening on the bottom plate; the reflector plateis located between the bottom plate and the back plate, the clampingportion sequentially passes through the third opening and the firstopening, and the clamping portion and the boss clamp the back plate incooperation, a size of the first opening matches a size of the clampingportion, the positioning column sequentially passes through the thirdopening and the second opening, and a size of the second opening matchesa size of the positioning column; the reflector plate is adjacent to theboss, and a thickness of the reflector plate is same as a thickness ofthe boss.
 15. The direct-type backlight module according to claim 14,wherein, a shape of the first opening is rectangular, a length of thefirst opening is 5 mm to 10 mm, and a width of the first opening is 3 mmto 5 mm; a shape of the second opening is circular; a diameter of thesecond opening is 2.1 mm to 3.2 mm; a shape of the third opening isrectangular, a length of the third opening is 22.2 mm to 24.2 mm, and awidth of the third opening is 2.1 mm to 3.2 mm.
 16. The direct-typebacklight module according to claim 14, wherein when the clampingportion comprises a slot, a depth of the slot is equal to a thickness ofthe back plate.
 17. The direct-type backlight module according to claim14, comprising a plurality of diffusion plate support frames and aplurality of backlight sources arranged in an array; each of theplurality of diffusion plate support frames is located between twoadjacent rows of backlight sources arranged along a first direction; theplurality of diffusion plate support frames are uniformly distributed inthe first direction, two adjacent diffusion plate support frames in asecond direction are arranged in a staggered arrangement, and the firstdirection intersects the second direction; or, the plurality ofdiffusion plate support frames are uniformly distributed in the firstdirection and the second direction, respectively, and the firstdirection intersects the second direction.
 18. The direct-type backlightmodule according to claim 17, wherein, the first direction isperpendicular to the second direction; a distance between two adjacentbacklight sources is 40 mm to 60 mm; a distance between two adjacentdiffusion plate support frames in the first direction is 150 mm to 200mm; a distance between two adjacent diffusion plate support frames inthe second direction is 100 mm to 150 mm; when a number of the supportportions on a same bottom plate is N, a distance between two adjacentsupport portions is equal to the distance between two adjacent backlightsources.
 19. The direct-type backlight module according to claim 14,wherein a distance between the diffusion plate and the support portionis greater than or equal to 1 mm and less than or equal to 2 mm.
 20. Adisplay apparatus, comprising the direct-type backlight module accordingto claim 13.